At 3:00 pm on March 17, 2008, the School of Materials of Henan University of Technology and Sanwa
Diamond Tools Co., Ltd. of India held the signing ceremony of the technology transfer of “ceramic bond diamond grinding tools” in the conference room of the Materials College. At the signing ceremony, Zou Wenjun, dean of the School of Materials, Niu Jinping, deputy dean and deputy secretary, and Mr. AR Salgame, head of Sanwan, and other relevant personnel.
At the signing ceremony, Dean Zou introduced the outstanding achievements of our institute in the transformation of scientific research achievements in recent years, and fully affirmed the smooth development of this cooperation. It is hoped that Sanwa and the School of Materials will establish a good cooperative relationship through the signing of this technology agreement, laying a solid foundation for deeper cooperation in a wider range of fields in the future. Mr. Salgame introduced the basic situation of Sanwa. The company occupies an important position in the domestic and international stone and concrete cutting field in India. By introducing ceramic bond diamond abrasive technology, it will enhance the company's technical strength and expand its business scope. Develop new products to open up new domestic and international markets. He wished the two units to take this opportunity to carry out long-term cooperation and seek common development.
Finally, in a pleasant atmosphere, Dean Zou Wenjun and Mr. Salgame signed the agreement on behalf of both parties and took a group photo.
The ceramic bond
Diamond Grinding Wheel has the advantages of high temperature resistance, high processing efficiency, good rigidity, good shape of the cutting tool during the grinding process, and dimensional accuracy of the finished product. Grinding natural gemstones and diamonds with ceramic bond diamond wheels maximizes grinding efficiency, high quality workpieces, low wear ratio, high durability, long service life and low processing costs.
